slovodefinícia
chip scale packaging
(foldoc)		Chip Scale Packaging

(CSP) A type of surface mount {integrated
circuit} packaging that provides pre-speed-sorted, pre-tested
and pre-packaged die without requiring special testing. An
example is Motorola's Micro SMT packaging.

See also: chip-on-board, flip chip, multichip module,
known good die, ball grid array.

["Chip scale packaging gains at SMI. (Surface Mount
International)", Bernard Levine, Electronic News (1991), Sept
4, 1995 v41 n2081 p1(2)].

(2006-08-14)
podobné slovodefinícia
chip scale packaging
(foldoc)		Chip Scale Packaging

(CSP) A type of surface mount {integrated
circuit} packaging that provides pre-speed-sorted, pre-tested
and pre-packaged die without requiring special testing. An
example is Motorola's Micro SMT packaging.

See also: chip-on-board, flip chip, multichip module,
known good die, ball grid array.

["Chip scale packaging gains at SMI. (Surface Mount
International)", Bernard Levine, Electronic News (1991), Sept
4, 1995 v41 n2081 p1(2)].

(2006-08-14)

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